This project aims to expand portable device capabilities beyond human vision through advanced THz to thermal infrared sensing and imaging systems. Following a structured research, the work begins with comprehensive study and modeling of how to bring antenna-coupled field-effect transistors can detect THz radiation and be optimized for the thermal infrared region exploiting the plasma-wave principle. After establishing theoretical foundations, the student will design and optimize individual sensing structures specifically tailored for infrared detection, validating their performance through rigorous characterization. The final phase will focus on scaling these optimized single-pixel designs into a complete infrared imaging array with appropriate readout and control circuitry. This multidisciplinary approach requires expertise in quasioptical and electromagnetic principles, device physics, noise analysis, and integrated circuit design. Technical work encompasses high-level modeling of devices, sensitivity optimization, noise propagation analysis, novel pixel architecture development, and full circuit implementation from schematic to layout.
The candidate will meet regularly with an industrial advisor from Sony and will spend a research period of six months at the company, providing a unique opportunity to interact with experts in the fields of computer vision and CMOS image sensors.
Through collaboration with experts in image sensors, THz/IR detectors, and analog circuit design, the student will develop specialized knowledge across these domains. The project objective is the demonstration of a functioning infrared imaging array. The intellectual property resulting from the doctoral student’s research activities will be owned by FBK and the Company.